Temperature-based assymetry correction during CMP and nozzle for media dispensing
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.
1. A chemical mechanical polishing apparatus comprising:
a rotatable platen to hold a polishing pad;
a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
a first actuator to oscillate the carrier across the polishing pad;
a polishing liquid supply port to supply a polishing liquid to the polishing surface;
a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface;
a second actuator to move the nozzle radially relative to an axis of rotation of the platen; and
a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface to generate a plurality of radial annular zones of different temperatures and to synchronize oscillation of the carrier with rotation of the carrier to periodically align one or more angular swaths of the substrate with one of the radial annular zones.
2. The apparatus of claim 1 , wherein the controller is configured to coordinate dispensing of the medium so as to reduce angular asymmetrical polishing of the substrate.
3. The apparatus of claim 1 , wherein the medium is a heated gas.
4. The apparatus of claim 1 , wherein the medium is a cooled liquid.
5. The apparatus of claim 1 , wherein the nozzle is suspended from an arm and the arm is supported by a rotatable base so as to pivot the arm over the polishing surface.
6. The apparatus of claim 1 , wherein the nozzle is suspended from an arm and the arm is extendable and retractable by an actuator.
7. The apparatus of claim 1 , wherein the nozzle is suspended from and linearly movable along an arm, and comprising an actuator to move the nozzle along the arm.
8. The apparatus of claim 1 , wherein the controller is configured to cause actuator to move the nozzle and cause the nozzle to dispense the medium in coordination to generate a first and second zones that are different temperature and that are concentric rings about an axis of rotation of the platen and that are different temperature.
9. The apparatus of claim 1 , wherein the controller is configured to cause the nozzle to dispense the medium to generate first and second regions that are different temperatures and that are arcuate segments along a ring that is concentric ring about an axis of rotation of the platen.
10. The apparatus of claim 1 , wherein a gap between the nozzle and the polishing surface is adjustable.
11. A chemical mechanical polishing apparatus comprising:
a platen to hold a polishing pad;
a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of the polishing surface; and
a controller configured to coordinate dispensing of the medium with motion of the polishing pad to generate a plurality of arcuate segments of different temperature and to synchronize rotation of the carrier with rotation of the platen to periodically align one or more angular swaths of the substrate with one of the arcuate segments.
12. The apparatus of claim 11 , wherein the thermal control system includes a movable nozzle to spray a medium onto the polishing surface.
13. The apparatus of claim 11 , wherein the medium is a heated gas.
14. The apparatus of claim 11 , wherein the medium is a cooled liquid.