Patent Assignment
Reel/Frame 066635/0348
Assignment of Assignor's Interest
Recorded: 2024-03-04
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method of Bonded Wafer
Application:
18/594,398 →
Publication:
US 2024/0304448