Patent Assignment
Reel/Frame 066703/0821
Assignment of Assignor's Interest
Recorded: 2024-03-08
Pages: 4
Assignors
NODA, MANAMI
Executed: 2024-02-19
FUKUSHIMA, NAOZUMI
Executed: 2024-02-28
OKUNAGA, TAKESHI
Executed: 2024-02-19
Assignee
NIPPON PILLAR PACKING CO., LTD.
7-1, SHINMACHI 1-CHOME, NISHI-KU, OSAKA-SHI, OSAKA, 550-0013, JAPAN
Covered Property
(1)
Dielectric, Copper Clad Laminate, Circuit Board, Method for Manufacturing Copper Clad Laminate
Patent:
12,336,096 →
Application:
18/597,541 →