Patent Assignment
Reel/Frame 066716/0802
Assignment of Assignor's Interest
Recorded: 2024-03-11
Pages: 16
Assignors
HSU, CHIA-HAO
Executed: 2020-01-07
CHEN, TAI-YU
Executed: 2020-01-07
TSAI, SHIANN-TSONG
Executed: 2020-01-08
LIU, HSING-CHIH
Executed: 2020-01-08
HSU, YAO-PANG
Executed: 2020-01-09
CHEN, CHI-YUAN
Executed: 2020-01-07
LEE, CHUNG-FA
Executed: 2020-01-07
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure