Patent Assignment
Reel/Frame 066729/0136
Assignment of Assignor's Interest
Recorded: 2024-03-12
Pages: 4
Assignee
STMICROELECTRONICS (CROLLES 2) SAS
850 RUE JEAN MONNET, CROLLES, 38920, FRANCE
Covered Property
(1)
Method for Dicing a Semiconductor Wafer
Application:
18/602,230 →
Publication:
US 2024/0321639
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 12, 2024
From: PARKER, DAVID
To: STMICROELECTRONICS (ROUSSET) SAS
Reel/Frame 066729/0173 →
Assignment of Assignor's Interest
Jul 29, 2024
From: STMICROELECTRONICS (ROUSSET) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068113/0432 →
Assignment of Assignor's Interest
Aug 2, 2024
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068165/0426 →