Patent Assignment
Reel/Frame 066729/0173
Assignment of Assignor's Interest
Recorded: 2024-03-12
Pages: 3
Assignor
PARKER, DAVID
Executed: 2024-02-09
Assignee
STMICROELECTRONICS (ROUSSET) SAS
ZI DE PEYNIER-ROUSSET, AVENUE COQ, ROUSSET, 13790, FRANCE
Covered Property
(1)
Method for Dicing a Semiconductor Wafer
Application:
18/602,230 →
Publication:
US 2024/0321639
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 12, 2024
From: SUAREZ SEGOVIA, CARLOS AUGUSTO; BAR, PIERRE
To: STMICROELECTRONICS (CROLLES 2) SAS
Reel/Frame 066729/0136 →
Assignment of Assignor's Interest
Jul 29, 2024
From: STMICROELECTRONICS (ROUSSET) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068113/0432 →
Assignment of Assignor's Interest
Aug 2, 2024
From: STMICROELECTRONICS (CROLLES 2) SAS
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068165/0426 →