IP Library › Assignment 066778/0101
Patent Assignment
Reel/Frame 066778/0101

Assignment of Assignor's Interest

Recorded: 2024-03-14 Pages: 3
Assignors
BOLOGNIA, DAVID
Executed: 2009-07-13
KUO, BOB SHIH WEI
Executed: 2009-06-15
TROCHE, BUD
Executed: 2009-06-30
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Reversible Top/Bottom MEMS Package
Patent: 9,776,855 →
Application: 15/174,911 →
Publication: US 2016/0355395
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →