Patent Assignment
Reel/Frame 066831/0393
Assignment of Assignor's Interest
Recorded: 2024-03-19
Pages: 3
Assignor
KIRBY, KYLE K.
Executed: 2021-04-19
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Semiconductor Interconnect Structures with Vertically Offset Bonding Surfaces, and Associated Systems and Methods