IP Library › Assignment 066834/0692
Patent Assignment
Reel/Frame 066834/0692

Assignment of Assignor's Interest

Recorded: 2024-03-20 Pages: 4
Assignors
CHU, CHIA-HUNG
Executed: 2020-09-10
SHIH, DING-KANG
Executed: 2020-10-05
LIN, KENG-CHU
Executed: 2020-09-20
TSAI, PANG-YEN
Executed: 2020-10-05
LIANG, SHUEN-SHIN
Executed: 2020-09-10
HUNG, TSUNGYU
Executed: 2020-10-05
WANG, SUNG-LI
Executed: 2020-09-10
CHANG, HSU-KAI
Executed: 2020-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Backside Contact Structures with Stacked Metal Silicide Layers for Source/Drain Region of Fin Field Transistors
Application: 17/371,245 →
Publication: US 2023/0012147
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 20, 2024
From: CHU, CHIA-HUNG; SHIH, DING-KANG; LIN, KENG-CHU; TSAI, PANG-YEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 068343/0001 →