IP Library › Assignment 066906/0299
Patent Assignment
Reel/Frame 066906/0299

Assignment of Assignor's Interest

Recorded: 2024-03-26 Pages: 5
Assignors
JUNG, BOO YANG
Executed: 2010-10-28
PAEK, JONG SIK
Executed: 2010-10-25
LEE, CHOON HEUNG
Executed: 2010-10-25
PARK, IN BAE
Executed: 2010-10-25
KIM, SANG WON
Executed: 2010-10-22
KIM, SUNG KYU
Executed: 2010-10-25
LEE, SANG GYU
Executed: 2010-10-25
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Wafer Level Fan Out Semiconductor Device and Manufacturing Method Thereof
Application: 15/656,654 →
Publication: US 2017/0323862
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →