Assignment of Assignor's Interest

Recorded: 2024-03-26 Pages: 6

Assignors

DREIZA, MAHMOUD

Executed: 2011-09-28

BALLANTINE, ANDREW

Executed: 2011-09-28

SHUMWAY, RUSSELL SCOTT

Executed: 2011-09-16

Assignee

AMKOR TECHNOLOGY, INC.

2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284

Covered Property (1)

Molded Cavity Substrate Mems Package Fabrication Method and Structure

Patent: 9,346,668 →

Application: 14/710,361 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.