IP Library › Assignment 066938/0822
Patent Assignment
Reel/Frame 066938/0822

Assignment of Assignor's Interest

Recorded: 2024-03-28 Pages: 3
Assignors
LIOU, JOUNG-WEI
Executed: 2019-07-16
LAN, CHIN KUN
Executed: 2019-07-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Structure Having High Breakdown Voltage Etch-Stop Layer
Application: 18/608,349 →
Publication: US 2024/0266292