Patent Assignment
Reel/Frame 066982/0058
Assignment of Assignor's Interest
Recorded: 2024-04-02
Pages: 5
Assignors
YEH, SHU-SHEN
Executed: 2020-12-07
LAI, PO-CHEN
Executed: 2020-12-07
YANG, CHE-CHIA
Executed: 2020-12-18
LIAO, LI-LING
Executed: 2020-12-08
LIN, PO-YAO
Executed: 2020-12-07
JENG, SHIN-PUU
Executed: 2020-12-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Containing Chip Structure with Inclined Sidewalls