IP Library › Assignment 066986/0970
Patent Assignment
Reel/Frame 066986/0970

Assignment of Assignor's Interest

Recorded: 2024-04-03 Pages: 4
Assignors
CHIANG, HUNG-LI
Executed: 2019-04-29
CHENG, CHAO-CHING
Executed: 2019-04-29
CHEN, TZU-CHIANG
Executed: 2019-04-29
CHEN, I-SHENG
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Isolation Structures Of Semiconductor Devices
Application: 18/624,386 →
Publication: US 2024/0250122