IP Library › Assignment 066992/0030
Patent Assignment
Reel/Frame 066992/0030

Assignment of Assignor's Interest

Recorded: 2024-04-03 Pages: 9
Assignors
KIM, JAE YUN
Executed: 2016-08-15
HWANG, TAE KYUNG
Executed: 2016-08-18
KIM, JIN HAN
Executed: 2016-08-18
PAEK, JONG SIK
Executed: 2016-07-15
KIM, BYONG JIN
Executed: 2016-08-18
SHIM, JAE BEUM
Executed: 2016-08-18
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package Using a Contact in a Pleated Sidewall Encapsulant Opening
Patent: 9,871,011 →
Application: 15/018,635 →
Publication: US 2016/0233187
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →