Patent Assignment
Reel/Frame 067117/0353
Assignment of Assignor's Interest
Recorded: 2024-04-16
Pages: 3
Assignor
HABA, BELGACEM
Executed: 2020-08-04
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Device Packages with Integrated Device Die and Dummy Element
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.