Patent Assignment
Reel/Frame 067124/0753
Change of Name
Recorded: 2024-04-16
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Device Packages with Integrated Device Die and Dummy Element
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.