Patent Assignment
Reel/Frame 067215/0146
License
Recorded: 2024-04-24
Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVENUE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties
(4)
Semiconductor Devices and Systems with Channel Openings or Pillars Extending Through a Tier Stack, and Methods of Formation
Electronic Devices and Systems with Channel Openings or Pillars Extending Through a Tier Stack, and Methods of Formation
Methods of Forming Electronic Devices with Channel Openings or Pillars Extending Through a Tier Stack
Microelectronic Devices with Pillars or Openings Extending Through a Tiered Stack
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 11, 2018
From: HOPKINS, JOHN D.; LOMELI, NANCY M.; DORHOUT, JUSTIN B.; FAZIL, DAMIR
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047218/0324 →
Supplement No. 12 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement
Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest
Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →