Patent Assignment
Reel/Frame 067218/0141
Assignment of Assignor's Interest
Recorded: 2024-04-25
Pages: 3
Assignors
CHEN, YU-AN
Executed: 2021-08-26
LEE, I-CHANG
Executed: 2021-08-27
TING, CHIH-YUAN
Executed: 2021-08-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Methods of Forming the Same