IP Library › Assignment 067227/0197
Patent Assignment
Reel/Frame 067227/0197

Security Interest

Recorded: 2024-04-25 Pages: 11
Assignor
HYPERTECHNOLOGIE CIARA INC.
Executed: 2024-01-23
Assignee
NATIONAL BANK OF CANADA
500 PLACE D'ARMES, 21ST FLOOR, MONTREAL, H2Y 2W3, CANADA
Covered Properties (5)
Title Not Available
Application: 63/545,830 →
Apparatus for Thermoelectric Recovery of Electronic Waste Heat
Application: 14/961,347 →
Publication: US 2017/0162774
Cpu Cooling System with Direct Spray Cooling
Application: 16/099,049 →
Publication: US 2020/0105645
Fluid Flow Tunnelling in a Non-Metallic Computer Chassis
Application: 16/316,975 →
Publication: US 2019/0317569
Microgap System for Cooling Electronics with Direct Contact
Application: 17/614,047 →
Publication: US 2022/0253112
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2017
From: AHDOOT, ELIOT
To: HYPERTECHNOLOGIE CIARA INC.
Reel/Frame 042968/0512 →
Assignment of Assignor's Interest Nov 5, 2018
From: HINTON, MICHAEL; MYDLARSKI, LAURENT
To: HYPERTECHNOLOGIE CIARA INC.
Reel/Frame 047413/0898 →
Assignment of Assignor's Interest Jan 21, 2019
From: AHDOOT, ELIOT
To: HYPERTECHNOLOGIE CIARA INC.
Reel/Frame 048071/0656 →
Assignment of Assignor's Interest Feb 15, 2022
From: HINTON, MICHAEL; MYDLARSKI, LAURENT
To: HYPERTECHNOLOGIE CIARA INC.
Reel/Frame 059011/0984 →