CPU cooling system with direct spray cooling

1. A spray chamber for cooling a computer processor on a circuit board, the spray chamber comprising:

a wall assembly for sealable mounting directly on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the exposed cooling surface of the computer processor, the wall assembly having a board fastening system adapted to removably fasten to the circuit board and to form a hermetic seal between the spray chamber and the exposed cooling surface of the computer processor, wherein the board fastening system comprises mounting arms that are compatible with a standard heatsink mounting mechanism of the circuit board; and

a lid for covering the top opening of the wall assembly in a sealable manner, the lid being removable and having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor, the wall assembly and the lid being distinct and separate parts which together form the spray chamber.

2. The spray chamber of claim 1 , wherein the heatsink mounting mechanism comprises a standardized screw hole pattern which is a part of an Independent Loading Mechanism (ILM) thereby the mounting arms are compatible with the ILM.

3. The spray chamber of claim 2 , wherein the circuit board comprises a central processing unit socket that comprises the ILM.

4. The spray chamber of claim 1 , further comprising a lid fastening system adapted to fasten and to form a hermetic seal between the wall assembly and the lid.

5. The spray chamber of claim 1 , wherein the nozzle comprises more than one nozzle arranged according to an array pattern.

6. The spray chamber of claim 1 , further comprising an inlet adapted to receive the coolant and a chamber outlet adapted to allow outflow of the coolant from the spray chamber.

7. The spray chamber of claim 6 , wherein the inlet and the outlet are located in the lid.

8. The spray chamber of claim 6 , wherein the outlet is located in the wall assembly.

9. A cooling system for cooling a computer processor on a circuit board, the cooling system comprising:

a pump for pumping a coolant;

a heat rejection unit where the coolant can release heat;

a spray chamber comprising a wall assembly for sealable mounting on an exposed cooling surface of the computer processor and a lid for covering a top opening of the wall assembly in a sealable manner, the wall assembly and the lid being distinct and separate parts which together define the spray chamber for mounting directly on the exposed cooling surface of the computer processor and enclosing the exposed cooling surface of the computer processor,

the wall assembly having a board fastening system adapted to removably fasten to the circuit board and to form a hermetic seal between the spray chamber and the exposed cooling surface of the computer processor, the board fastening system comprising mounting arms that are compatible with a

standard heatsink mounting mechanism of the circuit board;

coolant-circulation assembly for transporting the coolant through the pump, the spray chamber and the heat rejection unit, the coolant-circulation assembly, the pump, the spray chamber and the heat rejection unit forming a closed-loop for transporting the coolant; and

a reservoir for holding the coolant, the reservoir being integrated in the closed-loop;

wherein:

the spray chamber is adapted for spraying the coolant on the exposed cooling surface of the computer processor;

the wall assembly defines an enclosure having the top opening and a bottom opening which opens on the exposed cooling surface of the computer processor; and

the lid is removable and has a nozzle which sprays the coolant that impinges on the exposed cooling surface of the computer processor.

10. The cooling system of claim 9 , wherein the lid further comprises a lid reservoir where the coolant is accumulated and pressurized by the pump.

11. The cooling system of claim 9 , wherein the heatsink mounting mechanism comprises a standardized screw hole pattern which is a part of the Independent Loading Mechanism (ILM) thereby the mounting arms are compatible with the ILM.

12. The cooling system of claim 11 , wherein the circuit board comprises a central processing unit socket that comprises the ILM.

13. A method for cooling a computer processor on a circuit board, the method comprising:

sealably mounting a wall assembly with a board fastening system directly on an exposed cooling surface of the computer processor, defining an enclosure having a top opening and a bottom opening which opens on the exposed cooling surface of the computer processor, the board fastening system being adapted to removably fasten to the circuit board and to form a hermetic seal between the enclosure and the exposed cooling surface of the computer processor, the board fastening system comprising mounting arms that are compatible with a standard heatsink mounting mechanism of the circuit board;

sealably mounting a lid, distinct and separate from the wall assembly, for covering the top opening of the wall assembly, the lid being removable and having a nozzle; and

with the nozzle, spraying coolant that impinges on the exposed cooling surface of the computer processor.