Patent Assignment
Reel/Frame 067227/0375
Assignment of Assignor's Interest
Recorded: 2024-04-25
Pages: 8
Assignors
ISHIZUKA, RYUJI
Executed: 2024-04-05
YONEDA, YOSHIHIRO
Executed: 2024-04-01
HOSOI, TOSHIHIRO
Executed: 2024-04-01
KAGEYAMA, YUJI
Executed: 2024-04-11
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Double-Sided Copper Clad Laminate, Capacitor Element and Printed Wiring Board with Built-in Capacitor, and Method for Manufacturing Double-Sided Copper Clad Laminate
Application:
18/704,680 →
Publication:
US 2025/0046520
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.