Patent Assignment
Reel/Frame 067231/0446
Assignment of Assignor's Interest
Recorded: 2024-04-26
Pages: 8
Assignors
TOGASAKI, KEI
Executed: 2024-02-14
MITSUKURA, KAZUYUKI
Executed: 2024-02-12
TOBA, MASAYA
Executed: 2024-02-17
IWASHITA, KENICHI
Executed: 2024-04-24
ONO, KEISHI
Executed: 2024-02-14
NARITA, MAO
Executed: 2024-02-13
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Method for Manufacturing Wiring Board, and Wiring Board
Application:
18/294,158 →
Publication:
US 2024/0341039