Patent Assignment
Reel/Frame 067316/0576
Assignment of Assignor's Interest
Recorded: 2024-05-06
Pages: 5
Assignors
FU, YI-MIN
Executed: 2021-11-09
HO, CHI-CHING
Executed: 2021-11-09
KANG, CHENG-YU
Executed: 2021-11-09
WANG, YU-PO
Executed: 2021-11-09
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof