IP Library › Assignment 067468/0835
Patent Assignment
Reel/Frame 067468/0835

Assignment of Assignor's Interest

Recorded: 2024-05-20 Pages: 8
Assignor
AMKOR TECHNOLOGY KOREA, INC.
Executed: 2019-12-17
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12-03, SINGAPORE, 248373, SINGAPORE
Covered Property (1)
Device Chip Scale Package Including a Protective Layer and Method of Manufacturing a Device Chip Scale Package
Application: 18/669,033 →
Publication: US 2024/0304550
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 20, 2024
From: KIM, TAE KI; SHIM, JAE BEOM; SON, SEUNG NAM; DO, WON CHUL
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 067468/0773 →