Patent Assignment
Reel/Frame 067642/0118
Assignment of Assignor's Interest
Recorded: 2024-06-06
Pages: 9
Assignors
WANG, FEI
Executed: 2024-05-29
XU, HUI
Executed: 2024-05-29
SUN, TENG
Executed: 2024-05-29
LIU, GANG
Executed: 2024-05-29
UN, TAN CHONG
Executed: 2024-05-29
Assignee
SANDISK TECHNOLOGIES LLC
7501 N CAPITAL OF TEXAS HWY, BUILDING A, SUITE #100, AUSTIN, TEXAS, 78731
Covered Property
(1)
Semiconductor Package Having a Semiconductor Die Layer
Application:
18/735,529 →
Publication:
US 2025/0379186
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →