IP Library Assignment 067643/0639
Patent Assignment
Reel/Frame 067643/0639

Assignment of Assignor's Interest

Recorded: 2024-06-06 Pages: 2
Assignor
TAKAHASHI, YUZURU
Executed: 2024-05-29
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property (1)
Hot Melt Adhesive Composition
Application: 17/616,084 →
Publication: US 2022/0315804
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →