Patent Assignment
Reel/Frame 067673/0866
Assignment of Assignor's Interest
Recorded: 2024-06-10
Pages: 3
Assignors
LEE, JI YOUNG
Executed: 2024-05-24
CHA, JOON HYUB
Executed: 2024-05-24
JUNG, DONG JUN
Executed: 2024-05-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component