Patent Assignment
Reel/Frame 067739/0477
Assignment of Assignor's Interest
Recorded: 2024-06-17
Pages: 3
Assignors
FANG, YU-JING
Executed: 2021-09-08
HSU, HSIANG-CHUN
Executed: 2021-09-08
CHANG, CHENG-PING
Executed: 2021-09-08
Assignee
LEXTAR ELECTRONICS CORPORATION
NO.3, GONGYE E. 3RD RD., HSINCHU SCIENCE PARK, HSINCHU, 30075, TAIWAN
Covered Property
(1)
Diode Package Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.