Patent Assignment
Reel/Frame 067997/0427
Assignment of Assignor's Interest
Recorded: 2024-07-16
Pages: 6
Assignors
KIM, JINTAE
Executed: 2024-05-15
PARK, PANJAE
Executed: 2024-07-12
SEO, KANG-ILL
Executed: 2024-05-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Lower Interconnect Metal Layers at Cell Boundaries and Methods of Forming the Same