Patent Assignment
Reel/Frame 068006/0009
Assignment of Assignor's Interest
Recorded: 2024-07-17
Pages: 10
Assignors
WU, HAORAN
Executed: 2024-07-10
CHIN, CHEE KEONG
Executed: 2024-07-11
LUO, FENG
Executed: 2024-07-10
WANG, JIANHUA
Executed: 2024-07-10
ZHENG, YU
Executed: 2024-07-10
YAN, JUNRONG
Executed: 2024-07-10
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Semiconductor Package Having Interconnectable Substrates
Application:
18/774,312 →
Publication:
US 2026/0026374
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →