Patent Assignment
Reel/Frame 068265/0105
Assignment of Assignor's Interest
Recorded: 2024-08-13
Pages: 6
Assignors
ARIYOSHI, JUNICHI
Executed: 2024-06-05
YOSHIKAWA, SATOSHI
Executed: 2024-05-06
HABUCHI, TAKAFUMI
Executed: 2024-06-05
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Properties
(2)
Three-Dimensional Memory Device with Through-Stack Contact Assemblies and Methods for Forming the Same
Application:
18/784,146 →
Publication:
US 2025/0380415
Three-Dimensional Memory Device with Through-Stack Contact Assemblies and Methods for Forming the Same
Application:
63/656,457 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →