Patent Assignment
Reel/Frame 068279/0667
Assignment of Assignor's Interest
Recorded: 2024-08-14
Pages: 6
Assignors
JING, XIANGMENG
Executed: 2024-08-12
ZHANG, XIAODONG
Executed: 2024-08-12
XU, BIN
Executed: 2024-08-12
HUA, XIUWEN
Executed: 2024-08-12
Assignee
SHANGHAI X-RING TECHNOLOGY CO., LTD.
FLOOR 6, BUILDING 8, NO. 1357 JINHAI ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE, PUDONG NEW AREA, SHANGHAI, 201206, CHINA
Covered Property
(1)
Semiconductor Packaging Structure, Semiconductor Component and Electronic Device
Application:
18/804,298 →
Publication:
US 2025/0246504
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.