Patent Assignment
Reel/Frame 068289/0950
Assignment of Assignor's Interest
Recorded: 2024-08-02
Pages: 4
Assignor
TDK ELECTRONICS AG
Executed: 2024-04-23
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.