Assignment of Assignor's Interest

Recorded: 2024-08-19 Pages: 6

Assignors

DIXIT, ABHINANDAN

Executed: 2024-08-07

CHEN, DI

Executed: 2024-04-11

CHENG, AN-SHENG

Executed: 2024-04-08

Assignee

GAN SYSTEMS INC.

770 PALLADIUM DRIVE, SUITE 201, OTTAWA, K2V 1C8, CANADA

Covered Property (1)

Embedded Die Packaging for Power Semiconductor Devices for Improved Solder Reliability

Application: 18/522,911 →

Publication: US 2024/0213127

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.