Patent Assignment
Reel/Frame 069325/0968
Assignment of Assignor's Interest
Recorded: 2024-11-19
Pages: 4
Assignor
MOUSAVIAN, HOSSEIN
Executed: 2024-10-29
Assignee
INFINEON TECHNOLOGIES CANADA INC.
770 PALLADIUM DRIVE, SUITE 201, OTTAWA, K2V 1C8, CANADA
Covered Property
(1)
Embedded Die Packaging for Power Semiconductor Devices for Improved Solder Reliability
Application:
18/522,911 →
Publication:
US 2024/0213127
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.