Patent Assignment
Reel/Frame 068382/0974
Assignment of Assignor's Interest
Recorded: 2024-08-23
Pages: 4
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Injection Molding Device
Application:
18/813,513 →
Publication:
US 2025/0065551
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.