Assignment of Assignor's Interest

Recorded: 2024-12-03 Pages: 4

Assignor

SASAGAWA, KAKERU

Executed: 2024-11-18

Assignee

SEIKO EPSON CORPORATION

1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN

Covered Property (1)

Injection Molding Device

Application: 18/813,513 →

Publication: US 2025/0065551

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.