Assignment of Assignor's Interest

Recorded: 2024-08-29 Pages: 4

Assignor

LOH, HUNG MENG

Executed: 2024-08-29

Assignee

STMICROELECTRONICS PTE LTD

28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE

Covered Property (1)

Laminate Package Lid to Prevent Delamination

Application: 63/688,372 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.