IP Library › Assignment 068925/0810
Patent Assignment
Reel/Frame 068925/0810

Assignment of Assignor's Interest

Recorded: 2024-10-17 Pages: 6
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2024-10-07
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties (2)
Image Sensor Device with Different Width Cell Layers and Related Methods
Patent: 9,768,216 →
Application: 14/535,423 →
Publication: US 2016/0133662
Laminate Package Lid to Prevent Delamination
Application: 63/688,372 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 13, 2016
From: DELACRUZ, DAVE ALEXIS; GANI, DAVID
To: STMICROELECTRONICS PTE LTD
Reel/Frame 038896/0225 →
Assignment of Assignor's Interest Aug 29, 2024
From: LOH, HUNG MENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 068437/0980 →