IP Library › Assignment 068485/0471
Patent Assignment
Reel/Frame 068485/0471

Release of Security Interest

Recorded: 2024-09-04 Pages: 5
Assignor
THE BANK OF NEW YORK MELLON
Executed: 2024-08-22
Assignee
TELESAT TECHNOLOGY CORPORATION
160 ELGIN STREET, SUITE 2100, OTTAWA, K2P 2P7, CANADA
Covered Property (1)
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Patent: 7,397,114 →
Application: 11/362,732 →
Publication: US 2006/0138617
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2006
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018584/0346 →
Merger/Change of Name Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Release of Security Interest Sep 4, 2024
From: JPMORGAN CHASE BANK, N.A.
To: TELESAT TECHNOLOGY CORPORATION
Reel/Frame 068485/0463 →