Patent Assignment
Reel/Frame 018584/0346
Assignment of Assignor's Interest
Recorded: 2006-12-01
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2006-06-16
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(2)
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger/Change of Name
Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Release of Security Interest
Sep 4, 2024
From: JPMORGAN CHASE BANK, N.A.
To: TELESAT TECHNOLOGY CORPORATION
Reel/Frame 068485/0463 →
Release of Security Interest
Sep 4, 2024
From: THE BANK OF NEW YORK MELLON
To: TELESAT TECHNOLOGY CORPORATION
Reel/Frame 068485/0471 →