Patent Assignment
Reel/Frame 068502/0193
Assignment of Assignor's Interest
Recorded: 2024-09-05
Pages: 4
Assignors
HABA, BELGACEM
Executed: 2018-01-18
MOHAMMED, ILYAS
Executed: 2018-01-22
KATKAR, RAJESH
Executed: 2018-01-18
GUEVARA, GABRIEL Z.
Executed: 2018-01-22
DELACRUZ, JAVIER A.
Executed: 2018-01-18
HUANG, SHAOWU
Executed: 2018-01-18
MIRKARIMI, LAURA WILLS
Executed: 2018-01-22
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structures with Integrated Passive Component
Application:
18/782,477 →
Publication:
US 2025/0125248
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 5, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 068856/0012 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →