BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.
1 . A microelectronic device comprising:
a first insulating substrate;
a capacitor having a first surface and a second surface opposite the first surface, the first surface of the capacitor mechanically coupled to the first insulating substrate;
a second insulating substrate, the second surface of the capacitor mechanically coupled to the second insulating substrate such that the capacitor is disposed between the first and second insulating substrates;
an insulating element disposed between the first and second insulating substrates; and
a first interconnect extending through the first insulating substrate to electrically connect to a first terminal of the capacitor.