Patent Assignment
Reel/Frame 068856/0012
Change of Name
Recorded: 2024-09-05
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structures with Integrated Passive Component
Application:
18/782,477 →
Publication:
US 2025/0125248
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 5, 2024
From: HABA, BELGACEM; MOHAMMED, ILYAS; KATKAR, RAJESH; GUEVARA, GABRIEL Z.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 068502/0193 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →