Assignment of Assignor's Interest

Recorded: 2024-09-17 Pages: 7

Assignors

CHUNG, WONKEUN

Executed: 2024-09-11

KIM, BYOUNGHOON

Executed: 2024-09-11

LEE, JONGJIN

Executed: 2024-09-11

SEO, KANG-ILL

Executed: 2024-09-11

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Device Including Backside Contact Structure Formed Based on Wide Placeholder Structure

Application: 18/887,789 →

Publication: US 2025/0316594