Patent Assignment
Reel/Frame 068621/0982
Assignment of Assignor's Interest
Recorded: 2024-09-18
Pages: 5
Assignors
KIM, SU YUN
Executed: 2021-04-15
OH, DONG HOON
Executed: 2021-04-15
KWON, YONG TAE
Executed: 2021-04-15
LEE, JUN KYU
Executed: 2021-04-15
SHIN, KYEONG ROK
Executed: 2021-04-15
YEO, YONG WOON
Executed: 2021-04-19
Assignee
NEPES CO., LTD.
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, 27651, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Comprising First Molding Layer and Second Molding Layer with Different Thermal Expansion Coefficients
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.