Patent Assignment
Reel/Frame 068712/0396
Assignment of Assignor's Interest
Recorded: 2024-09-26
Pages: 3
Assignors
KODATE, HOKUTO
Executed: 2024-09-04
KAGAWA, RYO
Executed: 2024-09-04
IWATA, DAI
Executed: 2024-09-04
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Multilayer Electrode Devices and Method of Making the Same
Application:
18/882,410 →
Publication:
US 2026/0075849
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement (Supplemental)
Nov 14, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0486 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →