IP Library › Assignment 068895/0058
Patent Assignment
Reel/Frame 068895/0058

Assignment of Assignor's Interest

Recorded: 2024-10-15 Pages: 4
Assignor
LEE, YI-TING
Executed: 2023-09-07
Assignee
SIEMENS INDUSTRY SOFTWARE LIMITED, TAIWAN BRANCH
11F, NO 120, SEC 2, GONGDAU 5TH ROAD, HSINCHU, HSZ300, TAIWAN
Covered Property (1)
Path-Based Layer Stack Connectivity Check for Plasma Induced Damage Avoidance
Application: 18/856,912 →
Publication: US 2025/0117524
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2024
From: SRINIVASAN, SRIDHAR; LING, LEI; LEE, CHUNG
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068894/0969 →
Assignment of Assignor's Interest Oct 15, 2024
From: SIEMENS INDUSTRY SOFTWARE LIMITED, TAIWAN BRANCH
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068895/0207 →
Merger and Change of Name Oct 15, 2024
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068895/0427 →