IP Library Granted Patent US 12,572,701
Granted Patent B2
US 12,572,701 · App. 18/856,912 · Granted Mar 10, 2026

Path-based layer stack connectivity check for plasma induced damage avoidance

Inventors: Sridhar Srinivasan (Tualatin, OR); Yi-Ting Lee (Zhubei City, TW); Lei Ling (Fremont, CA); Chung Lee (Tigard, OR)
Assignee: Siemens Industry Software Inc.
G06F21/71G06F30/367G06F30/398G06F2119/10
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Quick Facts
Patent No.
US 12,572,701
App. No.
18/856,912
Granted
Mar 10, 2026
Kind
B2
Abstract

This application discloses a computing system implementing a reliability verification tool to identify a portion of a layout design describing an integrated circuit includes a victim transistor having a gate connected to an aggressor transistor. The reliability verification tool can extract a resistance network for connections between the victim transistor and the aggressor transistor, and simulate the resistive network to determine connectivity between the wells of the victim transistor and the aggressor transistor occurs prior to the victim transistor having a gate connected to an aggressor transistor.

Claims (56)

1 . A method comprising:

identifying, by a computing system, a portion of a layout design describing an integrated circuit includes a victim transistor having a gate connected to an aggressor transistor, wherein the victim transistor and the aggressor transistor have wells;

extracting, by the computing system, a resistance network for connections between the victim transistor and the aggressor transistor;

simulating, by the computing system, the resistive network to determine connectivity between the wells of the victim transistor and the aggressor transistor, and determine connectivity between the gate of the victim transistor and the aggressor transistor; and

applying, by the computing system, one or more connectivity rules to the determined connectivity between the wells of the victim transistor and the aggressor transistor and the determined connectivity between the gate of the victim transistor and the aggressor transistor to ascertain that the manufacture of the portion of the layout design avoids plasma induced damage when, during manufacture of the integrated circuit, the connectivity between the wells of the victim transistor and the aggressor transistor is formed prior to the victim transistor having the gate connected to the aggressor transistor.

2 . The method of claim 1 , wherein simulating the resistive network further comprises:

setting resistor values of a connection between the gate of the victim transistor and the aggressor transistor to block current to flow through the connection;

injecting current at a source region of the aggressor transistor in the resistive network; and

detecting a reception of the injected current at a source region of the victim transistor in the resistive network, which confirms the connectivity between the wells of the victim transistor and the aggressor transistor.

3 . The method of claim 2 , further comprising:

setting resistor values of the connection between the gate of the victim transistor and the aggressor transistor to unblock current to flow through the connection;

injecting, at a drain region of the aggressor transistor in the resistive network, current towards the gate of the victim transistor; and

detecting a reception of the injected current at the gate of the victim transistor in the resistive network, which confirms the connection between the aggressor transistor and the gate of the victim transistor.

4 . The method of claim 1 , wherein extracting the resistance network for connections between the victim transistor and the aggressor transistor includes an extraction of shared intervening circuitry coupled to the wells of the victim transistor and the aggressor transistor.

5 . The method of claim 4 , wherein the shared intervening circuitry includes at least one of a current pump circuit coupled between source regions of the aggressor transistor and the victim transistor or a different well in the substrate coupled as a soft connection between source regions of the aggressor transistor and the victim transistor.

6 . The method of claim 1 , further comprising:

detecting, by the computing system through a design rule check process, the layout design includes a connectivity error corresponding to one or more design rules; and

waiving, by the computing system, the connectivity error based on the determination of the connectivity between the wells of the victim transistor and the aggressor transistor occurs prior to the victim transistor having the gate connected to the aggressor transistor.

7 . A system comprising:

a memory system configured to store computer-executable instructions; and

a computing system, in response to execution of the computer-executable instructions, is configured to:

identify a portion of a layout design describing an integrated circuit includes a victim transistor having a gate connected to an aggressor transistor, wherein the victim transistor and the aggressor transistor have wells;

extract a resistance network for connections between the victim transistor and the aggressor transistor; and

simulate the resistive network to determine connectivity between the wells of the victim transistor and the aggressor transistor, and determine connectivity between the gate of the victim transistor and the aggressor transistor; and

apply one or more connectivity rules to the determined connectivity between the wells of the victim transistor and the aggressor transistor and the determined connectivity between the gate of the victim transistor and the aggressor transistor to ascertain that the manufacture of the portion of the layout design avoids plasma induced damage when, during manufacture of the integrated circuit, the connectivity between the wells of the victim transistor and the aggressor transistor is formed prior to the victim transistor having the gate connected to the aggressor transistor.

8 . The system of claim 7 , wherein simulating the resistive network further comprises:

setting resistor values of a connection between the gate of the victim transistor and the aggressor transistor to block current to flow through the connection;

injecting current at a source region of the aggressor transistor in the resistive network; and

detecting a reception of the injected current at a source region of the victim transistor in the resistive network, which confirms the connectivity between the wells of the victim transistor and the aggressor transistor.

9 . The system of claim 8 , wherein simulating the resistive network further comprises:

setting resistor values of the connection between the gate of the victim transistor and the aggressor transistor to unblock current to flow through the connection;

injecting, at a drain region of the aggressor transistor in the resistive network, current towards the gate of the victim transistor; and

detecting a reception of the injected current at the gate of the victim transistor in the resistive network, which confirms the connection between the aggressor transistor and the gate of the victim transistor.

10 . The system of claim 7 , wherein extracting the resistance network for connections between the victim transistor and the aggressor transistor includes an extraction of shared intervening circuitry coupled to the wells of the victim transistor and the aggressor transistor.

11 . The system of claim 10 , wherein the shared intervening circuitry includes at least one of a current pump circuit coupled between source regions of the aggressor transistor and the victim transistor or a different well in the substrate coupled as a soft connection between source regions of the aggressor transistor and the victim transistor.

12 . The system of claim 7 , where the computing system, in response to execution of the computer-executable instructions, is further configured to:

detect, through a design rule check process, the layout design includes a connectivity error corresponding to one or more design rules; and

waive the connectivity error based on the determination of the connectivity between the wells of the victim transistor and the aggressor transistor occurs prior to the victim transistor having the gate connected to the aggressor transistor.

13 . An apparatus comprising at least one computer-readable memory device storing instructions configured to cause one or more processing devices to perform operations comprising:

identifying a portion of a layout design describing an integrated circuit includes a victim transistor having a gate connected to an aggressor transistor, wherein the victim transistor and the aggressor transistor have wells;

extracting a resistance network for connections between the victim transistor and the aggressor transistor; and

simulating the resistive network to determine connectivity between the wells of the victim transistor and the aggressor transistor, and determine connectivity between the gate of the victim transistor and the aggressor transistor; and

applying one or more connectivity rules to the determined connectivity between the wells of the victim transistor and the aggressor transistor and the determined connectivity between the gate of the victim transistor and the aggressor transistor to ascertain that the manufacture of the portion of the layout design avoids plasma induced damage when, during manufacture of the integrated circuit, the connectivity between the wells of the victim transistor and the aggressor transistor is formed prior to the victim transistor having the gate connected to the aggressor transistor.

14 . The apparatus of claim 13 , wherein simulating the resistive network further comprises:

setting resistor values of a connection between the gate of the victim transistor and the aggressor transistor to block current to flow through the connection;

injecting current at a source region of the aggressor transistor in the resistive network; and

detecting a reception of the injected current at a source region of the victim transistor in the resistive network, which confirms the connectivity between the wells of the victim transistor and the aggressor transistor.

15 . The apparatus of claim 14 , wherein simulating the resistive network further comprises:

setting resistor values of the connection between the gate of the victim transistor and the aggressor transistor to unblock current to flow through the connection;

injecting, at a drain region of the aggressor transistor in the resistive network, current towards the gate of the victim transistor; and

detecting a reception of the injected current at the gate of the victim transistor in the resistive network, which confirms the connection between the aggressor transistor and the gate of the victim transistor.

16 . The apparatus of claim 13 , wherein extracting the resistance network for connections between the victim transistor and the aggressor transistor includes an extraction of shared intervening circuitry coupled to the wells of the victim transistor and the aggressor transistor.

17 . The apparatus of claim 16 , wherein the shared intervening circuitry includes at least one of a current pump circuit coupled between source regions of the aggressor transistor and the victim transistor or a different well in the substrate coupled as a soft connection between source regions of the aggressor transistor and the victim transistor.

18 . The apparatus of claim 13 , wherein the instructions are further configured to cause the one or more processing devices to perform operations comprising:

detecting, through a design rule check process, the layout design includes a connectivity error corresponding to one or more design rules; and

waiving the connectivity error based on the determination of the connectivity between the wells of the victim transistor and the aggressor transistor occurs prior to the victim transistor having the gate connected to the aggressor transistor.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2024
From: SRINIVASAN, SRIDHAR; LING, LEI; LEE, CHUNG
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068894/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2024
From: LEE, YI-TING
To: SIEMENS INDUSTRY SOFTWARE LIMITED, TAIWAN BRANCH
Reel/Frame 068895/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2024
From: SIEMENS INDUSTRY SOFTWARE LIMITED, TAIWAN BRANCH
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068895/0207 →
MERGER AND CHANGE OF NAME Recorded Oct 15, 2024
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 068895/0427 →
Continuity (2)
Provisional Application 63364884 · May 18, 2022
Related Publication 20250117524A1 · Apr 10, 2025
References Cited (15)
US 8595669B1 · Keller · 2013 [cited by examiner]
US 10771108B1 · Fazeel · 2020 [cited by examiner]
US 20120210283A1 · Li · 2012 [cited by examiner]
US 20200279817A1 · Missoni et al. · 2020 [cited by applicant]
US 20210242194A1 · Ma · 2021 [cited by examiner]
US 20220163580A1 · Byrd · 2022 [cited by examiner]
CN 205069628U · 2016 [cited by applicant]
CN 107331662A · 2017 [cited by applicant]
JP 2011009579A · 2011 [cited by applicant]
WO 2004042809A1 · 2004 [cited by applicant]
Vittal Ashok et al: “Modeling crosstalk in resistive VLSI interconnections”, VLSI Design, 1999. Proceedings. Twelfth International Conference on GOA, India Jan. 7-10, 1999, Los Alamitos, CA, USA,IEEE Comput. Soc, US, Ja… [cited by applicant]
Etherton M et al: “Verification of CDM circuit simulation using an ESD evaluation circuit”, Electrical Overstress/Electrostatic Discharge Symposium, 2005. EOS/ESD '05, IEEE, Piscataway, NJ, USA, Sep. 8, 2005 (Sep. 8, 20… [cited by applicant]
Isogai T et al: “Advanced Method for Measuring Ultra-Low Contact Resistivity Between Silicide and Silicon Based on Cross Bridge Kelvin Resistor”, Microelectronic Test Structures, 2009. ICMTS 2009. IEEE International Con… [cited by applicant]
Li Junkang:; “High-performance low-power germanium Channel field effect transistor technology The research”; Ph. D. Electronic Journal; No. 202201 period; Jan. 15, 2022. [cited by applicant]
Landolt Olivier et al:; “Analog Nonlinear Function Synthesis”; IEEE Micro, pp. 50-52. [cited by applicant]